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Shaping What’s Next

At Interpack 2026 with Beckhoff
Fabio Fioravanti Fabio Fioravanti

At Interpack 2026 with Beckhoff

Our partner Beckhoff will attend Interpack 2026 in Düsseldorf from May 7–13, featuring the unique magnetic levitation architecture of the Lyvra™ platform developed by Tylent Technologies on the Beckhoff automation ecosystem.

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