At Interpack 2026 with Beckhoff

Düsseldorf, Germany — May 2026

Beckhoff Automation will participate in Interpack 2026, one of the world’s leading trade fairs for processing and packaging technologies, taking place in Düsseldorf, Germany.

During the event, Beckhoff will present a range of automation solutions and application case studies demonstrating how advanced motion control, PC-based automation, and magnetic levitation transport systems are enabling new possibilities across multiple industries.

Among the showcased applications will be the collaboration with Tylent Technologies, focused on the development of Lyvra™, an advanced platform for automated intravenous compounding in hospital and centralized pharmacy environments.

Interpack: a global meeting point for automation innovation

Held every three years in Düsseldorf, Interpack is widely recognized as one of the most important international events for packaging and processing technologies, bringing together industry leaders, system integrators, technology providers, and innovation partners from around the world.

The event provides a platform to showcase new automation concepts, emerging technologies, and cross-industry collaborations that are shaping the future of manufacturing and processing systems.

A “Magnetic” Partnership: Beckhoff and Tylent Technologies

The Lyvra™ project highlights how close collaboration between automation technology providers and system developers can enable new architectures for complex applications.

By combining Beckhoff’s automation ecosystem with Tylent Technologies’ expertise in healthcare automation and pharmaceutical workflows, the project explores new approaches to modular system design, parallel process execution, and scalable automation in controlled environments.

Visitors to Interpack 2026 will have the opportunity to learn more about this collaboration and how magnetic levitation technologies such as XPlanar are opening new possibilities for advanced automation systems.